DocumentCode
1496537
Title
Effects of Spatial Dispersion on Reflection From Mushroom-Type Artificial Impedance Surfaces
Author
Luukkonen, Olli ; Silveirinha, Mário G. ; Yakovlev, Alexander B. ; Simovski, Constantin R. ; Nefedov, Igor S. ; Tretyakov, Sergei A.
Author_Institution
Dept. of Radio Sci. & Eng., TKK Helsinki Univ. of Technol., Helsinki, Finland
Volume
57
Issue
11
fYear
2009
Firstpage
2692
Lastpage
2699
Abstract
In a spatially dispersive medium, the electric dipole moment of an inclusion cannot be related to the macroscopic electric field through a local relation. Several recent works have emphasized the role of spatial dispersion in wire media, and demonstrated that arrays of parallel metallic wires may behave very differently from a uniaxial local material with negative permittivity. Here, we investigate the effect of spatial dispersion on reflection properties of the mushroom structure introduced by Sievenpiper, based on local and nonlocal homogenization methods. The objective of this paper is to clarify the role of spatial dispersion in the mushroom structure and demonstrate that, under some conditions, it is suppressed. The metamaterial substrate, or metasurface is modeled as a wire medium covered with an impedance surface. Surprisingly, it is found that, in such a configuration, the effects of spatial dispersion may be nearly suppressed when the slab is electrically thin, and that the wire medium can be modeled very accurately using a local model.
Keywords
dispersion (wave); dispersive media; electric moments; electromagnetic wave reflection; metamaterials; surface electromagnetic waves; electric dipole moment; local homogenization method; meta surface model; metamaterial substrate; mushroom-type artificial impedance surface; nonlocal homogenization method; parallel metallic wire media; reflection properties; spatial dispersion; Analytical modeling; high-impedance surfaces; mushroom structures; reflection properties; spatial dispersion; wire medium;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2009.2032458
Filename
5282500
Link To Document