• DocumentCode
    1496751
  • Title

    Parametric Macromodeling of Lossy and Dispersive Multiconductor Transmission Lines

  • Author

    Ferranti, Francesco ; Antonini, Giulio ; Dhaene, Tom ; Knockaert, Luc

  • Author_Institution
    Dept. of Inf. Technol., Ghent Univ., Ghent, Belgium
  • Volume
    33
  • Issue
    2
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    481
  • Lastpage
    491
  • Abstract
    We propose an innovative parametric macromodeling technique for lossy and dispersive multiconductor transmission lines (MTLs) that can be used for interconnect modeling. It is based on a recently developed method for the analysis of lossy and dispersive MTLs extended by using the multivariate orthonormal vector fitting (MOVF) technique to build parametric macromodels in a rational form. They take into account design parameters, such as geometrical layout or substrate features, in addition to frequency. The presented technique is suited to generate state-space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. Parametric macromodels allow to perform design space exploration, design optimization, and sensitivity analysis efficiently. Numerical examples validate the proposed approach in both frequency and time domain.
  • Keywords
    dispersive channels; equivalent circuits; interconnected systems; multiconductor transmission lines; optimisation; sensitivity analysis; state-space methods; SPICE-like solvers; build parametric macromodels; design optimization; design space exploration; dispersive multiconductor transmission lines; equivalent circuit synthesis; innovative parametric macromodeling technique; interconnect modeling; lossy multiconductor transmission lines; multivariate orthonormal vector fitting; sensitivity analysis; state-space models; Interconnects; parametric macromodeling; rational approximation; transient analysis;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2027892
  • Filename
    5282533