• DocumentCode
    1496759
  • Title

    Millimeter-Wave Chip-to-Chip Transmission Using an Insulated Image Guide Excited by an On-Chip Dipole Antenna at 90 GHz

  • Author

    Dolatsha, Nemat ; Hesselbarth, Jan

  • Author_Institution
    Lab. for Electromagn. Fields & Microwave Electron. (IFH), ETH Zurich, Zurich, Switzerland
  • Volume
    22
  • Issue
    5
  • fYear
    2012
  • fDate
    5/1/2012 12:00:00 AM
  • Firstpage
    266
  • Lastpage
    268
  • Abstract
    A millimeter-wave chip-to-chip transmission link operating at 90 GHz is presented. It uses an insulated image guide and on-chip dipole antennas positioned in the entrance of the waveguide for excitation and reception. The on-chip dipole antenna couples to the higher-order Ex11 mode of a synthesized insulated image waveguide. This field coupling avoids the need for conductive connections such as wire-bonds or flip-chip technology. The measured insertion loss of such a field-coupled dipole-to-image guide transition is 0.46 dB at 90 GHz.
  • Keywords
    dipole antennas; millimetre wave antennas; waveguides; conductive connection; field coupling; field-coupled dipole-to-image guide transition; flip-chip technology; frequency 90 GHz; insertion loss; insulated image waveguide; millimeter-wave chip-to-chip transmission link; on-chip dipole antenna; wire-bond; Antenna measurements; Dielectrics; Dipole antennas; Loss measurement; Millimeter wave technology; Semiconductor device measurement; System-on-a-chip; Dielectric waveguide; millimeter-waves; waveguide excitation;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2012.2190273
  • Filename
    6184337