• DocumentCode
    1496792
  • Title

    Physical origin of long-term charge loss in floating-gate EPROM with an interpoly oxide-nitride-oxide stacked dielectric

  • Author

    Pan, Cheng-Sheng ; Wu, Ken ; Sery, George

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • Volume
    12
  • Issue
    2
  • fYear
    1991
  • Firstpage
    51
  • Lastpage
    53
  • Abstract
    The long-term charge loss characteristic in a floating-gate EPROM cell with an oxide-nitride-oxide (ONO) interpoly stacked dielectric has been studied quantitatively. It is found that trapped electrons at the nitride-oxide interface can directly tunnel through a thin approximately 30-AA top oxide. The estimated tunneling barrier height is about 2.6 eV, which is consistent with the previous result based on MNOS studies. The thermal activation of the long-term charge loss is believed to be caused by the availability of trapped electrons at the top oxide-nitride interface. The thermal activation energy of the long-term charge loss is about 0.37 eV, which is similar to the activation energy of the second phase. It is believed that the trapped electron density at the top oxide-nitride interface becomes larger at higher temperatures due to the activated electron movement during the second phase.<>
  • Keywords
    EPROM; integrated circuit technology; integrated memory circuits; 30 A; activated electron movement; floating-gate EPROM; higher temperatures; interpoly oxide-nitride-oxide stacked dielectric; long-term charge loss characteristic; physical origin of charge; thermal activation energy; trapped electron density; trapped electrons; tunneling barrier height; Dielectric losses; EPROM; Electron traps; Helium; Oxidation; Silicon compounds; Substrates; Testing; Threshold voltage; Tunneling;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.75700
  • Filename
    75700