DocumentCode
1496792
Title
Physical origin of long-term charge loss in floating-gate EPROM with an interpoly oxide-nitride-oxide stacked dielectric
Author
Pan, Cheng-Sheng ; Wu, Ken ; Sery, George
Author_Institution
Intel Corp., Santa Clara, CA, USA
Volume
12
Issue
2
fYear
1991
Firstpage
51
Lastpage
53
Abstract
The long-term charge loss characteristic in a floating-gate EPROM cell with an oxide-nitride-oxide (ONO) interpoly stacked dielectric has been studied quantitatively. It is found that trapped electrons at the nitride-oxide interface can directly tunnel through a thin approximately 30-AA top oxide. The estimated tunneling barrier height is about 2.6 eV, which is consistent with the previous result based on MNOS studies. The thermal activation of the long-term charge loss is believed to be caused by the availability of trapped electrons at the top oxide-nitride interface. The thermal activation energy of the long-term charge loss is about 0.37 eV, which is similar to the activation energy of the second phase. It is believed that the trapped electron density at the top oxide-nitride interface becomes larger at higher temperatures due to the activated electron movement during the second phase.<>
Keywords
EPROM; integrated circuit technology; integrated memory circuits; 30 A; activated electron movement; floating-gate EPROM; higher temperatures; interpoly oxide-nitride-oxide stacked dielectric; long-term charge loss characteristic; physical origin of charge; thermal activation energy; trapped electron density; trapped electrons; tunneling barrier height; Dielectric losses; EPROM; Electron traps; Helium; Oxidation; Silicon compounds; Substrates; Testing; Threshold voltage; Tunneling;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.75700
Filename
75700
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