Title :
High-Voltage-Tolerant ESD Clamp Circuit With Low Standby Leakage in Nanoscale CMOS Process
Author :
Ker, Ming-Dou ; Lin, Chun-Yu
Author_Institution :
Dept. of Electron. Eng., I-Shou Univ., Kaohsiung, Taiwan
fDate :
7/1/2010 12:00:00 AM
Abstract :
For system-on-chip applications with mixed-voltage I/O interfaces, I/O circuits with low-voltage devices must drive or receive high-voltage signals to communicate with other circuit blocks. With the consideration of low standby leakage in nanoscale CMOS processes, a new 2 × VDD-tolerant electrostatic discharge (ESD) clamp circuit by using only 1 × VDD devices was presented in this paper. The new ESD clamp circuit had a high-voltage-tolerant ESD detection circuit to improve the turn-on efficiency of an ESD clamp device, which consisted of a silicon-controlled rectifier (SCR) with a diode in series. This design had successfully been verified in a 65-nm CMOS process. The leakage current of this ESD clamp circuit under normal circuit operating condition was only on the order of 100 nA. The test patterns with 25- and 50-m SCR-based ESD clamp devices can achieve 2.6- and 4.8-kV human-body-model ESD robustness, respectively. Such high-voltage-tolerant ESD clamp circuits, by using only low-voltage devices with very low standby leakage current and high ESD robustness, were very suitable for mixed-voltage I/O interfaces in nanoscale CMOS processes.
Keywords :
CMOS integrated circuits; electrostatic discharge; leakage currents; rectifiers; system-on-chip; ESD detection circuit; I/O circuits; diode; high-voltage-tolerant ESD clamp circuit; low standby leakage; low-voltage devices; mixed-voltage I/O interfaces; nanoscale CMOS process; silicon-controlled rectifier; size 65 nm; system-on-chip application; CMOS process; Circuits; Clamps; Electrostatic discharge; Leakage current; Nanoscale devices; Rectifiers; Robustness; System-on-a-chip; Thyristors; Electrostatic discharge (ESD); low-voltage CMOS; mixed-voltage I/O; power-rail ESD clamp circuit; silicon-controlled rectifier (SCR);
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2010.2049072