Title :
Implementation of a Monolithic Single Proof-Mass Tri-Axis Accelerometer Using CMOS-MEMS Technique
Author :
Sun, Chih-Ming ; Tsai, Ming-Han ; Liu, Yu-Chia ; Fang, Weileun
Author_Institution :
Inst. of NEMS, Nat. Tsing Hua Univ., Hsinchu, Taiwan
fDate :
7/1/2010 12:00:00 AM
Abstract :
This paper presents a novel single proof-mass tri-axis capacitive type complementary metal oxide semiconductor-microelectromechanical system accelerometer to reduce the footprint of the chip. A serpentine out-of-plane (Z-axis) spring is designed to reduce cross-axis sensitivity. The tri-axis accelerometer has been successfully implemented using the TSMC 2P4M process and in-house postprocessing. The die size of this accelerometer chip containing the MEMS structure and sensing circuits is 1.78 × 1.38 mm, a reduction of nearly 50% in chip size. Within the measurement range of ~0.8 6G, the tri-axis accelerometer sensitivities (nonlinearity) of each direction are 0.53 mV/G (2.64%) for the X-axis, 0.28 mV/G (3.15%) for the Y-axis, and 0.2 mV/G (3.36%) for the Z-axis, respectively. In addition, the cross-axis sensitivities of these three axes range from 1% to 8.3% for the same measurement range. The noise floors in each direction are 120 mG/rtHz for the X-axis, 271 mG/rtHz for the Y-axis, and 357 mG/rtHz for the Z-axis.
Keywords :
CMOS integrated circuits; accelerometers; micromechanical devices; CMOS-MEMS technique; TSMC 2P4M process; Z-axis spring; capacitive type complementary metal oxide semiconductor; cross-axis sensitivity; microelectromechanical system accelerometer; monolithic single proof-mass tri-axis accelerometer; serpentine out-of-plane spring; Accelerometers; CMOS process; CMOS technology; Consumer electronics; Costs; Electrodes; Fabrication; Micromechanical devices; Sensor systems and applications; Sun; Complementary metal oxide semiconductor (CMOS)-MEMS; tri-axis accelerometer;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2010.2048791