DocumentCode :
1497250
Title :
SiGe p-channel MOSFETs with tungsten gate
Author :
Ternent, G. ; Asenov, A. ; Thayne, I.G. ; Macintyre, D.S. ; Thoms, S. ; Wilkinson, C.D.W. ; Parker, E.H.C. ; Gundlach, A.M.
Author_Institution :
Dept. of Electron. & Electr. Eng., Glasgow Univ., UK
Volume :
35
Issue :
5
fYear :
1999
fDate :
3/4/1999 12:00:00 AM
Firstpage :
430
Lastpage :
431
Abstract :
A self-aligned SiGe p-channel MOSFET tungsten gate process with 0.1 μm resolution is demonstrated. Interface charge densities of MOS capacitors realised with the low pressure sputtered tungsten process are comparable with thermally evaporated aluminium gate technologies (5×1010cm-2 and 2×1011 cm -2 for W and Al, respectively). Initial results from 1 μm gate length SiGe p-channel MOSFETs using the tungsten-based process show devices with a transconductance of 33 mS/mm and effective channel mobility of 190 cm2/Vs
Keywords :
Ge-Si alloys; MOS capacitors; MOSFET; carrier mobility; semiconductor materials; silicon compounds; sputter deposition; tungsten; 1 micron; MOS capacitors; SiGe-SiO2-W; effective channel mobility; interface charge densities; low pressure sputtered process; p-channel MOSFETs; semiconductor materials; transconductance;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19990305
Filename :
757166
Link To Document :
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