• DocumentCode
    1497550
  • Title

    Raised source/drain MOSFET with dual sidewall spacers

  • Author

    Rodder, Mark ; Yeakley, D.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • Volume
    12
  • Issue
    3
  • fYear
    1991
  • fDate
    3/1/1991 12:00:00 AM
  • Firstpage
    89
  • Lastpage
    91
  • Abstract
    A raised source/drain (S/D) MOSFET with sidewall spacers formed both before and after selective epitaxial silicon deposition in S/D regions is discussed. The second spacer overlies any faceted regions of the epitaxial silicon near the gate edge and has advantages for MOSFETs with implant-doped or in-situ doped epitaxial silicon regions. In particular, the spacer can prevent S/D dopants from being implanted through any thinner faceted regions near the gate edge, which would otherwise result in a deeper than desired junction depth in the silicon substrate. Additionally, the spacer can prevent source-to-substrate salicide shorts through the thinner faceted regions.<>
  • Keywords
    insulated gate field effect transistors; ion implantation; semiconductor doping; Si; dual sidewall spacers; ion implantation; raised source/drain MOSFET; selective epitaxial Si deposition; source substrate salicide shorts prevention; thinner faceted regions; Doping profiles; Etching; Fabrication; Hydrogen; Implants; MOSFET circuits; Silicides; Silicon; Substrates; Temperature;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.75721
  • Filename
    75721