Title :
System Integration Challenges for a Slider With an Integrated Microactuator
Author :
Hoheisel, Dominik ; Cvetkovic, Srecko ; Kurniawan, Willyanto ; Obermeier, Ernst ; Gatzen, Hans H.
Author_Institution :
Produktionstechnisches Zentrum, Leibniz Univ. Hannover, Garbsen, Germany
fDate :
6/1/2010 12:00:00 AM
Abstract :
To develop a system integration process for a slider with an integrated microactuator (SLIM), quite a few challenges had to be resolved. They include processes for double rowbar stacking and thinning, chiplet mounting, slider separation, and chiplet cross crown fabrication, to name just a few. The slider separation process is particularly challenging: during this process, the mounting bars suspended on thin Si leaf springs are released. This paper discusses the challenges encountered and the system integration solutions developed.
Keywords :
hard discs; microactuators; Si; chiplet cross crown fabrication; chiplet mounting; double rowbar stacking; integrated microactuator; slider separation; system integration; thin Si leaf; thinning; Bars; Electromagnets; Fabrication; Insulation life; Microactuators; Micromagnetics; Separation processes; Silicon on insulator technology; Springs; Stacking; Electromagnetic microactuator; hard disc drive;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2010.2040373