Title :
Corrosive gas environmental testing for electrical contacts
Author :
Gore, Randy R. ; Witska, Rich ; Kirby, J. Ray ; Chao, James L.
Author_Institution :
IBM Corp., Research Triangle Park, NC, USA
fDate :
3/1/1990 12:00:00 AM
Abstract :
Corrosive gas environmental tests are used to predict reliability of electrical connectors used in data system products under conditions found in business office environments. IBM´s corrosive gaseous environmental acceleration test, called G1(T), were evaluated for variations in testing conditions, in particular for those which differ from outside testing standards used in the connector industry. The purpose was to determine those features of various acceleration tests which could be recommended for adoption into an industrywide testing standard. Copper, nickel, and porous gold coupons (electroplated gold over nickel over copper) were used to determine the effects of each corrosive gas test environment. The corrosion of copper was quantified by coulometric reduction, whereas that of nickel was evaluated by energy dispersive X-ray fluorescence analysis. The porous gold coupons were visually examined for the presence of pore and creep corrosion, which allow the degree of environmental exposure to be quickly ascribed. Results for various test conditions are presented and evaluated
Keywords :
copper; corrosion testing; electrical contacts; environmental testing; gold; life testing; materials testing; nickel; Cu; G1(T); IBM tests; Ni; acceleration tests; business office environments; corrosion gas environmental testing; corrosive gas test environment; corrosive gaseous environmental acceleration test; coulometric reduction; creep corrosion; data system products; electrical contacts; energy dispersive X-ray fluorescence analysis; industrywide testing standard; porous Au; reliability prediction; test conditions; visually examined; Connectors; Contacts; Copper; Corrosion; Data systems; Electrical products industry; Gold; Life estimation; Nickel; System testing;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on