DocumentCode :
1498050
Title :
Photonics challenge to electronic packaging
Author :
Gilleo, Ken
Author_Institution :
Cookson Electron., Foxboro, MA, USA
Volume :
24
Issue :
2
fYear :
2001
fDate :
6/1/2001 12:00:00 AM
Firstpage :
309
Lastpage :
311
Abstract :
Photonics packaging is a challenge to electronic packaging for two important reasons. The first and most obvious is that light must have access to the device. There must be a window, port or optical fiber interface. The other and more serious problem is that most devices require a highly controlled atmosphere. And if having to accommodate both electrons and photons were not enough, innovators have added mechanical motion to optical devices. Micro-opto-electro-mechanical systems (MOEMS) bring photonics, electronics, optics, physics and mechanical engineering together on one semiconductor device. This appears to be the ultimate convergence of technology domains and can also include biology and chemistry
Keywords :
micro-optics; packaging; electronic packaging; micro-opto-electro-mechanical system; photonics packaging; Atmosphere; Biomedical optical imaging; Electron optics; Electronics packaging; Mechanical engineering; Optical devices; Optical fibers; Photonics; Physics; Semiconductor devices;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.926399
Filename :
926399
Link To Document :
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