DocumentCode
1498050
Title
Photonics challenge to electronic packaging
Author
Gilleo, Ken
Author_Institution
Cookson Electron., Foxboro, MA, USA
Volume
24
Issue
2
fYear
2001
fDate
6/1/2001 12:00:00 AM
Firstpage
309
Lastpage
311
Abstract
Photonics packaging is a challenge to electronic packaging for two important reasons. The first and most obvious is that light must have access to the device. There must be a window, port or optical fiber interface. The other and more serious problem is that most devices require a highly controlled atmosphere. And if having to accommodate both electrons and photons were not enough, innovators have added mechanical motion to optical devices. Micro-opto-electro-mechanical systems (MOEMS) bring photonics, electronics, optics, physics and mechanical engineering together on one semiconductor device. This appears to be the ultimate convergence of technology domains and can also include biology and chemistry
Keywords
micro-optics; packaging; electronic packaging; micro-opto-electro-mechanical system; photonics packaging; Atmosphere; Biomedical optical imaging; Electron optics; Electronics packaging; Mechanical engineering; Optical devices; Optical fibers; Photonics; Physics; Semiconductor devices;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.926399
Filename
926399
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