• DocumentCode
    1498050
  • Title

    Photonics challenge to electronic packaging

  • Author

    Gilleo, Ken

  • Author_Institution
    Cookson Electron., Foxboro, MA, USA
  • Volume
    24
  • Issue
    2
  • fYear
    2001
  • fDate
    6/1/2001 12:00:00 AM
  • Firstpage
    309
  • Lastpage
    311
  • Abstract
    Photonics packaging is a challenge to electronic packaging for two important reasons. The first and most obvious is that light must have access to the device. There must be a window, port or optical fiber interface. The other and more serious problem is that most devices require a highly controlled atmosphere. And if having to accommodate both electrons and photons were not enough, innovators have added mechanical motion to optical devices. Micro-opto-electro-mechanical systems (MOEMS) bring photonics, electronics, optics, physics and mechanical engineering together on one semiconductor device. This appears to be the ultimate convergence of technology domains and can also include biology and chemistry
  • Keywords
    micro-optics; packaging; electronic packaging; micro-opto-electro-mechanical system; photonics packaging; Atmosphere; Biomedical optical imaging; Electron optics; Electronics packaging; Mechanical engineering; Optical devices; Optical fibers; Photonics; Physics; Semiconductor devices;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.926399
  • Filename
    926399