• DocumentCode
    1498160
  • Title

    Innovative low-cost power module

  • Author

    Hinchley, D.A. ; Rodriguez, M. ; Rahimo, M.T. ; Jones, S.R. ; Aliwell, R.W. ; Masana, F.N. ; Shammas, N.Y.A.

  • Author_Institution
    Semelab plc, Lutterworth, UK
  • Volume
    148
  • Issue
    2
  • fYear
    2001
  • fDate
    4/1/2001 12:00:00 AM
  • Firstpage
    85
  • Lastpage
    88
  • Abstract
    Semelab has developed the Smartpack, a compact plastic power module that represents a breakthrough in the packaging of semiconductor die. By virtue of its novel construction, the Smartpack is able to offer significant cost advantages. The Smartpack structure is compared with conventional module technology. The relative thermal performance is examined using finite-element analysis. Details of Smartpack applications are provided, illustrating the module´s inherent adaptability, Finally, the suitability of Smartpack for the high-reliability market is addressed
  • Keywords
    finite element analysis; modules; plastic packaging; semiconductor device packaging; Semelab; Smartpack; finite-element analysis; high-reliability market; low-cost power module; packaging; plastic power module; relative thermal performance; semiconductor die;
  • fLanguage
    English
  • Journal_Title
    Circuits, Devices and Systems, IEE Proceedings -
  • Publisher
    iet
  • ISSN
    1350-2409
  • Type

    jour

  • DOI
    10.1049/ip-cds:20010169
  • Filename
    926414
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1498160