DocumentCode
1498301
Title
Design Assessments of a Refined DC Magnetron Sputter With Multiple Magnetron Arrangements
Author
Liu, Cheng-Tsung ; Lai, Ming-Chih ; Hwang, Chang-Chou
Author_Institution
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume
46
Issue
6
fYear
2010
fDate
6/1/2010 12:00:00 AM
Firstpage
1614
Lastpage
1617
Abstract
The DC magnetron sputtering systems (MSS) are widely applied in the microelectronic industries for thin film depositions. With their large installation volume in the related production lines, many efforts have been devoted to explore the possible refinements of the MSS structures that can improve the operational performance and reduce the target material consumption rates. Supported by qualitative and quantitative investigations, this paper describes a general guidance that can be applied to those commercial in-line DC MSS to control the magnetic field affecting the electron trajectories inside the sputterers. Results obtained from detailed studies on the systems with both single cylindrical magnetron and multiple rectangular magnetron structures showed that the proposed refinement scheme can increase the sputtering efficiency by over 25%, and the corresponding enhancements of substrate deposition rates are also to be expected. In addition, compared with those obtained without the refinements, the target erosion profiles with the refinements are more evenly spread out, thus reduction in the target material consumptions can also be expected.
Keywords
magnetic field effects; permanent magnets; sputter deposition; DC magnetron sputtering systems; design assessments; electron trajectories; magnetic field; material consumption rates; microelectronic industries; multiple magnetron arrangement; multiple rectangular magnetron structure; single cylindrical magnetron structure; sputtering efficiency; substrate deposition rates; target erosion profiles; target material consumptions; thin film depositions; Electrons; Magnetic confinement; Magnetic fields; Magnetic flux; Magnetic materials; Microelectronics; Refining; Sputtering; Substrates; Trajectory; Magnetron sputtering system; permanent magnet; substrate deposition; target erosion;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/TMAG.2009.2037976
Filename
5467437
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