Title :
Recent Japanese developments in printed wiring boards for SMT
Author :
Takagi, Kiyoshi ; Yasufuku, Sachio
Author_Institution :
Furukawa Electr. Co. Ltd., Japan
Abstract :
Recent developments in printed wiring boards (PWBs) for use in surface mounting technology (SMT) in Japan are reviewed. Particular emphasis is placed on the high-density multilayer PWBs, which are important for SMT. Requirement for PWBs with respect to wiring density and housing capability, electrical properties, characteristics required at time of mounting, and reliability are discussed. Design, structure, and substrate materials are examined. The manufacture process is described. Quality assurance is addressed. Future prospects for PWBs are considered.<>
Keywords :
circuit reliability; packaging; printed circuit manufacture; surface mount technology; Japan; SMT; electrical properties; high-density multilayer PWBs; housing capability; manufacture process; printed wiring boards; reliability; substrate materials; wiring density; Delay; Electronic components; Electronic equipment; Electronics packaging; Inorganic materials; Large scale integration; Organic materials; Packaging machines; Surface-mount technology; Wiring;
Journal_Title :
Electrical Insulation Magazine, IEEE
