Title :
Insulation enhancement with heat-shrinkable components
Author :
Hoffman, John W.
Author_Institution :
Raychem Corp., Menlo Park, CA, USA
Abstract :
The basic performance requirements for heat-shrinkable components and the compounding and processing techniques that are used to meet these requirements are covered. The emphasis is on the electrical, mechanical, and environmental protection features of components for low-voltage (up to 1 kV) applications. The aim is to provide a fundamental understanding of the capabilities and applications of heat-shrinkable components for insulation enhancement and environmental protection of electrical systems. Cross-linking, polymer selection, compounding, manufacturing, sealants, installation, and product configurations are discussed.<>
Keywords :
organic insulating materials; polymers; compounding; electrical systems; environmental protection; heat-shrinkable components; insulation enhancement; manufacturing; polymer selection; processing techniques; product configurations; sealants; Dielectric materials; Dielectrics and electrical insulation; Electric resistance; Plastic insulation; Polymers; Power cables; Power systems; Resistance heating; Stress control; Temperature;
Journal_Title :
Electrical Insulation Magazine, IEEE
