• DocumentCode
    1498547
  • Title

    Efficient Modeling of Power/Ground Planes Using Delay-Extraction-Based Transmission Lines

  • Author

    Roy, Sourajeet ; Dounavis, Anestis

  • Author_Institution
    Dept. of Electr. & Comput. Eng. ing, Univ. of Western Ontario, London, ON, Canada
  • Volume
    1
  • Issue
    5
  • fYear
    2011
  • fDate
    5/1/2011 12:00:00 AM
  • Firstpage
    761
  • Lastpage
    771
  • Abstract
    This paper presents an efficient approach for modeling irregular shaped power distribution networks (PDN) in high-speed packages. The proposed methodology is based on discretization of the plane into an orthogonal grid of transmission line segments. Using a delay-extraction-based model for each line segment, a compact circuit model is achieved where the size of the circuit matrices depend only on the nodes of the orthogonally discretized structure and all other internal nodes due to the macromodel are eliminated. This approach of eliminating the internal variable due to the transmission line macromodel is further extended to model skin effect losses without augmenting the circuit matrices. The proposed work has been successfully implemented for a variety of PDN structures and geometries and has been shown to yield significant savings in memory and run time costs compared to the existing simulation program with integrated circuits emphasis macromodels.
  • Keywords
    integrated circuit modelling; integrated circuit packaging; matrix algebra; transmission lines; PDN structures; circuit matrices; compact circuit model; delay-extraction-based transmission lines; integrated circuits; orthogonal discretized structure; orthogonal grid; power distribution networks; power-ground planes; simulation program; skin effect loss; transmission line macromodel; transmission line segments; Approximation methods; Equations; Integrated circuit modeling; Mathematical model; Power transmission lines; Skin effect; Transmission line matrix methods; Delay extraction; macromodeling; networks; power distribution; resonance; skin effect; transmission lines;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2011.2117423
  • Filename
    5752831