DocumentCode :
1498547
Title :
Efficient Modeling of Power/Ground Planes Using Delay-Extraction-Based Transmission Lines
Author :
Roy, Sourajeet ; Dounavis, Anestis
Author_Institution :
Dept. of Electr. & Comput. Eng. ing, Univ. of Western Ontario, London, ON, Canada
Volume :
1
Issue :
5
fYear :
2011
fDate :
5/1/2011 12:00:00 AM
Firstpage :
761
Lastpage :
771
Abstract :
This paper presents an efficient approach for modeling irregular shaped power distribution networks (PDN) in high-speed packages. The proposed methodology is based on discretization of the plane into an orthogonal grid of transmission line segments. Using a delay-extraction-based model for each line segment, a compact circuit model is achieved where the size of the circuit matrices depend only on the nodes of the orthogonally discretized structure and all other internal nodes due to the macromodel are eliminated. This approach of eliminating the internal variable due to the transmission line macromodel is further extended to model skin effect losses without augmenting the circuit matrices. The proposed work has been successfully implemented for a variety of PDN structures and geometries and has been shown to yield significant savings in memory and run time costs compared to the existing simulation program with integrated circuits emphasis macromodels.
Keywords :
integrated circuit modelling; integrated circuit packaging; matrix algebra; transmission lines; PDN structures; circuit matrices; compact circuit model; delay-extraction-based transmission lines; integrated circuits; orthogonal discretized structure; orthogonal grid; power distribution networks; power-ground planes; simulation program; skin effect loss; transmission line macromodel; transmission line segments; Approximation methods; Equations; Integrated circuit modeling; Mathematical model; Power transmission lines; Skin effect; Transmission line matrix methods; Delay extraction; macromodeling; networks; power distribution; resonance; skin effect; transmission lines;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2011.2117423
Filename :
5752831
Link To Document :
بازگشت