Stiffness of `gull-wing´ leads and solder joints for a plastic quad flat pack

Author

Lau, John H. ; Harkins, C. Girvin

Author_Institution

Hewlett-Packard Lab., Palo Alto, CA, USA

Volume

13

Issue

1

fYear

1990

fDate

3/1/1990 12:00:00 AM

Firstpage

124

Lastpage

130

Abstract

A 12×12 stiffness matrix was obtained for the gull-wing lead and solder joint in a plastic quad flat pack (PQFP) surface-mount assembly, using a three-dimensional finite element method. Deformation of the composite structure for each imposed unit displacement (or rotation) was then obtained. It is shown that the whole-field stress distributions in the gull-wing lead provide a better understanding of their mechanical characteristics. The metallurgical response of the solder joints was not measured in this study

Keywords

deformation; fatigue cracks; finite element analysis; microassembling; soldering; stress analysis; surface mount technology; 3D FEM; composite structure deformation; gull-wing lead; mechanical characteristics; plastic quad flat pack; solder joints; stiffness matrix; surface-mount assembly; three-dimensional finite element method; whole-field stress distributions; Assembly; Electronics packaging; Finite element methods; Lead; Plastics; Sliding mode control; Soldering; Surface-mount technology; Thermal stresses; Transmission line matrix methods;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.52859

Filename

52859