• DocumentCode
    1499143
  • Title

    Deterministic Flow Lines With Applications

  • Author

    Morrison, James R.

  • Author_Institution
    Dept. of Ind. & Syst. Eng., KAIST, Daejeon, South Korea
  • Volume
    7
  • Issue
    2
  • fYear
    2010
  • fDate
    4/1/2010 12:00:00 AM
  • Firstpage
    228
  • Lastpage
    239
  • Abstract
    We demonstrate that flow line models with deterministic service times and an arbitrary arrival process may be exactly decomposed into segments that each exhibit similar behavior. We call the segments channels and demonstrate that this decomposition leads to a recursion for the delay experienced by customers within the system. The consequence, in addition to clearly elucidating the manner in which customers advance, is that the state of a flow line at any time can be completely characterized by a handful of parameters per channel. The recursions and channel decomposition allow us to model a class of state dependent failures that are common in certain cluster tools in semiconductor wafer manufacturing. Using the fact that wafers are typically grouped into batches, we are able to reduce the computation required to simulate the wafer advancement by about 50 times. The models have been tested with data from a clustered photolithography tool in production and provide throughput and process time predictions within 0.5% and 3% of the actual performance, respectively.
  • Keywords
    assembling; customer services; discrete event simulation; manufacturing systems; photolithography; semiconductor device manufacture; arbitrary arrival process; channel decomposition; clustered photolithography tool; deterministic flow lines; deterministic service times; flow line models; segments channels; semiconductor wafer manufacturing; state dependent failures; wafer advancement; Discrete-event simulation; flow line; photolithography cluster tools; semiconductor manufacturing automation;
  • fLanguage
    English
  • Journal_Title
    Automation Science and Engineering, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1545-5955
  • Type

    jour

  • DOI
    10.1109/TASE.2009.2027222
  • Filename
    5286234