• DocumentCode
    1500155
  • Title

    Preliminary studies for the development of superconducting composite wires

  • Author

    Provenzano, V. ; Henshaw, W.F. ; Edelstein, A.S. ; Singh, A.K. ; Imam, M.A. ; Osofsky, M.S. ; Skelton, E.F. ; Qadri, S.B.

  • Author_Institution
    US Naval Res. Lab., Washington, DC, USA
  • Volume
    25
  • Issue
    2
  • fYear
    1989
  • fDate
    3/1/1989 12:00:00 AM
  • Firstpage
    2320
  • Lastpage
    2323
  • Abstract
    The results reported are part of a larger effort, the basic aim of which is to develop high-Tc superconducting composite wires, films, and thin-gauge panels with large current carrying capacity and engineered thermal and mechanical properties. The results relate to the following aspects of this ongoing research effort: the sputtering parameters used to deposit Bi-Sr-Ca-Cu-O films on MgO and other substrates; a dipping technique to produce Bi-Sr-Ca-Cu-O superconducting layers and wires; the postannealing heat treatments; the characterization of the microstructure and crystallographic features of the deposited films; and the superconducting properties of the films, layers, and wires
  • Keywords
    bismuth compounds; calcium compounds; crystal atomic structure of inorganic compounds; crystal microstructure; heat treatment; high-temperature superconductors; sputter deposition; strontium compounds; superconducting thin films; Bi-Sr-Ca-Cu-O films; MgO; crystallographic features; dipping technique; films; high temperature superconductor; high-Tc superconducting composite wires; microstructure; postannealing heat treatments; sputtering parameters; superconducting composite wires; superconducting properties; thin-gauge panels; Annealing; High temperature superconductors; Mechanical factors; Research and development; Sputtering; Superconducting epitaxial layers; Superconducting filaments and wires; Superconducting films; Superconducting transition temperature; Thermal engineering;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.92773
  • Filename
    92773