• DocumentCode
    1500319
  • Title

    Brazing to low-temperature-fired thick films

  • Author

    Keusseyan, Roupen L.

  • Author_Institution
    Dupont Electron., Research Triangle Park, NC, USA
  • Volume
    13
  • Issue
    1
  • fYear
    1990
  • fDate
    3/1/1990 12:00:00 AM
  • Firstpage
    219
  • Lastpage
    221
  • Abstract
    The development of materials and processes for brazing leads, pins, and heat sinks to alumina ceramic substrates is presented. The substrates are metallized using either copper-, silver-, or gold-based thick-film pastes that are fired in the 850-950°C temperature range. The metal ceramic joint strengths obtained are comparable to those achieved using high-temperature fired tungsten- or molybdenum-based metallizations
  • Keywords
    alumina; brazing; ceramics; heat sinks; hybrid integrated circuits; integrated circuit technology; packaging; substrates; thick film circuits; 850 to 950 C; Ag thick film paste; Al2O3 ceramic substrates; Au thick film paste; Cu thick film paste; PGA; brazing; development of materials; heat sinks; leads; low-temperature-fired thick films; metal ceramic joint strengths; metallizations; pin grid array; pins; temperature range; Atmosphere; Ceramics; Filler metals; Heat sinks; Inorganic materials; Lead; Metallization; Pins; Substrates; Thick films;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.52874
  • Filename
    52874
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1500319