Data mining of printed-circuit board defects

Author

Kusiak, Andrew ; Kurasek, Christian

Author_Institution

Dept. of Ind. Eng., Iowa Univ., Iowa City, IA, USA

Volume

17

Issue

2

fYear

2001

fDate

4/1/2001 12:00:00 AM

Firstpage

191

Lastpage

196

Abstract

This paper discusses an industrial case study in which data mining has been applied to solve a quality engineering problem in electronics assembly. During the assembly process, solder balls occur underneath some components of printed circuit boards. The goal is to identify the cause of solder defects in a circuit board using a data mining approach. Statistical process control and design of experiment approaches did not provide conclusive results. The paper discusses features considered in the study, data collected, and the data mining solution approach to identify causes of quality faults in an industrial application

Keywords

assembling; data mining; design of experiments; printed circuit manufacture; quality control; statistical process control; PCB defects; SPC; assembly process; data mining; electronics assembly; experiment design; printed-circuit board defects; quality engineering; quality fault cause identification; solder balls; statistical process control; Assembly; Data engineering; Data mining; Electronics industry; Fault diagnosis; Industrial electronics; Mining industry; Printed circuits; Process control; Process design;

fLanguage

English

Journal_Title

Robotics and Automation, IEEE Transactions on

Publisher

ieee

ISSN

1042-296X

Type

jour

DOI

10.1109/70.928564

Filename

928564