DocumentCode :
1501293
Title :
Temperature-Insensitive Composite Micromechanical Resonators
Author :
Melamud, Renata ; Chandorkar, Saurabh A. ; Kim, Bongsang ; Lee, Hyung Kyu ; Salvia, James C. ; Bahl, Gaurav ; Hopcroft, Matthew A. ; Kenny, Thomas W.
Author_Institution :
SiTime, Sunnyvale, CA, USA
Volume :
18
Issue :
6
fYear :
2009
Firstpage :
1409
Lastpage :
1419
Abstract :
Utilizing silicon and silicon dioxide´s opposing temperature coefficients of Young´s modulus, composite resonators with zero linear temperature coefficient of frequency are fabricated and characterized. The resulting resonators have a quadratic temperature coefficient of frequency of approximately -20 ppb/degC2 and a tunable turnover temperature in the -55degC to 125degC range. Reduction of the temperature dependence of frequency is shown in flexural-mode resonators (700 kHz-1.3 MHz) and extensional-mode ring resonators (20 MHz). The linear temperature coefficient of Young´s modulus of silicon dioxide is extracted from measurements to be +179 ppm/degC. The composite resonators are fabricated and packaged in a CMOS-compatible wafer-scale hermetic encapsulation process. The long-term stability of the resonators is monitored for longer than six months. Although most devices exhibit less than 2 ppm frequency drift, there is evidence of dielectric charging in the silicon dioxide.
Keywords :
CMOS integrated circuits; Young´s modulus; encapsulation; micromechanical resonators; silicon; silicon compounds; temperature measurement; CMOS-compatible wafer-scale hermetic encapsulation process; Young´s modulus; composite resonators; dielectric charging; extensional-mode ring resonators; flexural-mode resonators; frequency 20 MHz; frequency 700 kHz to 1.3 MHz; silicon dioxide; temperature -55 C to 125 C; temperature coefficients; temperature-insensitive composite micromechanical resonators; Composite; Young´s modulus; resonators; temperature coefficient; temperature compensation;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2009.2030074
Filename :
5288574
Link To Document :
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