DocumentCode :
1501411
Title :
In Situ Doped Source/Drain for Performance Enhancement of Double-Gated Poly-Si Nanowire Transistors
Author :
Chen, Wei-Chen ; Lin, Horng-Chih ; Chang, Yu-Chia ; Lin, Chuan-Ding ; Huang, Tiao-Yuan
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume :
57
Issue :
7
fYear :
2010
fDate :
7/1/2010 12:00:00 AM
Firstpage :
1608
Lastpage :
1615
Abstract :
A poly-Si nanowire (NW) thin-film transistor configured with the double-gated scheme was fabricated and characterized. The fabrication process features the clever use of selective plasma etching to form a rectangular NW underneath a hard mask. In this paper, we show that replacing the original ion-implanted poly-Si with in situ doped poly-Si for the source/drain significantly enhances the device performance, including steeper subthreshold swing (SS), larger on/off current ratio, and reduced series resistance. In particular, the SS is improved to a record-breaking low value of 73 mV/dec, which, to the best of our knowledge, is the most ideal ever reported for a poly-Si based device. The new NW transistors with such excellent switching properties are highly promising for reducing power consumption and operational voltage in practical circuit applications.
Keywords :
nanowires; sputter etching; thin film transistors; doped source/drain; double-gated scheme; fabrication process; nanowire transistors; operational voltage; performance enhancement; power consumption; reduced series resistance; selective plasma etching; subthreshold swing; switching properties; thin film transistor; Crystallization; Doping; Etching; Fabrication; Microelectronics; Plasma applications; Plasma devices; Plasma sources; Substrates; Thin film transistors; in situ doping; Field-effect transistor; leakage; multiple gate; nanowire (NW); polycrystalline-Si (poly-Si);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2010.2049227
Filename :
5471146
Link To Document :
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