Title :
Theoretical Foundation for Upsets in CMOS Circuits Due to High-Power Electromagnetic Interference
Author :
Iliadis, Agis A. ; Kim, Kyechong
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
Abstract :
The performance and reliability of CMOS integrated circuits are severely affected by high-power electromagnetic interference (EMI), resulting in serious operational upsets, critical bit errors, and reversible or irreversible failures. Based on experimental evidence from individual MOSFETs and CMOS cascaded inverters, the fundamental causes for such upsets are examined, and a new theoretical foundation based on excess charge effects and the nonlinear continuity equation for high level injection is developed. A new modified drain current MOSFET equation that includes the effects of EMI is proposed. The key experimental evidence that leads to the development of the theory and the validation of the theory are discussed. Comparisons between the experimental and calculated results based on the modified equation were found to be in excellent agreement. The modified MOSFET equation can now be used in the design, modeling, and simulation of CMOS ICs to predict vulnerabilities and to improve reliability and performance of CMOS electronic systems operating in critical and adverse environments.
Keywords :
CMOS integrated circuits; MOSFET; electromagnetic interference; integrated circuit reliability; CMOS IC; CMOS circuits; CMOS electronic systems; EMI; cascaded inverters; critical bit errors; excess charge effects; high level injection; high-power electromagnetic interference; modified drain current MOSFET equation; nonlinear continuity equation; operational upsets; CMOS integrated circuits; Educational institutions; Electromagnetic interference; Integrated circuit reliability; MOSFETs; Nonlinear equations; Permission; Power system reliability; Predictive models; Pulse inverters; CMOS inverters; MOSFET output equation; MOSFETs; electromagnetic interference upsets;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2010.2050692