DocumentCode :
1501612
Title :
High current density 800-V 4H-SiC gate turn-off thyristors
Author :
Li, B. ; Cao, L. ; Zhao, J.H.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
Volume :
20
Issue :
5
fYear :
1999
fDate :
5/1/1999 12:00:00 AM
Firstpage :
219
Lastpage :
222
Abstract :
4H-SiC gate turn-off thyristors (GTOs) were fabricated using the recently developed inductively-coupled plasma (ICP) dry etching technique. DC and ac characterisation have been done to evaluate forward blocking voltage, leakage current, on-state voltage drop and switching performance. GTOs over 800 V dc blocking capability has been demonstrated with a blocking layer thickness of 7 μm. The dc on-state voltage drops of a typical device at 25 and 300/spl deg/C were 4.5 and 3.6 V, respectively, for a current density of 1000 A/cm2. The devices can be reliably turned on and turned off under an anode current density of 5000 A/cm2 without observable degradation.
Keywords :
high-temperature electronics; silicon compounds; sputter etching; thyristors; wide band gap semiconductors; 4H-SiC gate turn-off thyristor; 800 V; SiC; current density; forward blocking voltage; high-temperature power device; inductively-coupled plasma dry etching; leakage current; on-state voltage drop; switching; Anodes; Current density; Dry etching; Fabrication; Low voltage; Plasma applications; Plasma density; Silicon carbide; Thermal conductivity; Thyristors;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.761020
Filename :
761020
Link To Document :
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