• DocumentCode
    1501707
  • Title

    Thermal Characterization of Junction in Solar Cell Packages

  • Author

    Jang, Sun Ho ; Shin, Moo Whan

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Myongji Univ., Yongin, South Korea
  • Volume
    31
  • Issue
    7
  • fYear
    2010
  • fDate
    7/1/2010 12:00:00 AM
  • Firstpage
    743
  • Lastpage
    745
  • Abstract
    This is the first report on the direct measurement of the junction temperature and on the determination of thermal resistance of a commercial amorphous silicon (a-Si) solar cell package under real operating conditions. Thermal transient method was utilized for the thermal characterization. Irradiation of sunlight to the solar cell package was found to induce significant heat generation inside the solar cell package. It was shown that the driving of the solar cell package with a sun power of 1 sun (100 mW/cm2 and 1.5 AM) resulted in a junction temperature of about 113°C. Surprisingly, the temperature difference between the junction and the case surface of the solar cell package was as high as 43°C. The efficiency drop was observed with the increase of junction temperature in the solar cell package. Thermal resistance was determined under various operating conditions.
  • Keywords
    solar cells; thermal resistance; commercial amorphous silicon solar cell package; direct measurement; junction temperature; solar cell packages; thermal characterization; thermal resistance; thermal transient method; Junction temperature; solar cell; thermal resistance; thermal transient method;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2010.2048552
  • Filename
    5471188