DocumentCode
1501892
Title
Foreword
Volume
24
Issue
2
fYear
2001
fDate
5/1/2001 12:00:00 AM
Firstpage
119
Lastpage
119
Keywords
Aerospace electronics; Electronic components; Electronics packaging; Integrated circuit interconnections; Power system interconnection; Power system modeling; Power transmission lines; Radio frequency; Transmission line theory; Wafer scale integration;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2001.928744
Filename
928744
Link To Document