DocumentCode :
1501892
Title :
Foreword
Volume :
24
Issue :
2
fYear :
2001
fDate :
5/1/2001 12:00:00 AM
Firstpage :
119
Lastpage :
119
Keywords :
Aerospace electronics; Electronic components; Electronics packaging; Integrated circuit interconnections; Power system interconnection; Power system modeling; Power transmission lines; Radio frequency; Transmission line theory; Wafer scale integration;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2001.928744
Filename :
928744
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1501892
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