• DocumentCode
    1501902
  • Title

    Rules for robust generation of accurate reduced-order models for high-speed coupled interconnections

  • Author

    Cangellaris, Andreas C. ; Igarashi, Mitsuko

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • Volume
    24
  • Issue
    2
  • fYear
    2001
  • fDate
    5/1/2001 12:00:00 AM
  • Firstpage
    120
  • Lastpage
    125
  • Abstract
    Recently, robust algorithms have been established fur passive order reduction of electrical models of complex interconnection networks. However, very little is known about the way the order of the reduced model should be chosen to ensure accuracy in subsequent transient simulation studies, in this paper, a rule is derived for the selection of the order of the reduced model for interconnections modeled as transmission lines. It is shown that pulse rise time, interconnection length, and physical properties impact the order of the reduced model. The proposed rule is validated through numerical studies involving both analytic and numerical results from the frequency- and time-domain response of multiconductor transmission line circuits
  • Keywords
    circuit simulation; frequency-domain analysis; high-speed integrated circuits; integrated circuit interconnections; integrated circuit modelling; multiconductor transmission lines; reduced order systems; time-domain analysis; transient analysis; complex interconnection networks; electrical models; frequency-domain response; high-speed coupled interconnections; interconnection length; multiconductor transmission line circuits; physical properties; pulse rise time; reduced-order models; time-domain response; transient simulation studies; Circuit simulation; Computational modeling; Frequency; Function approximation; Integrated circuit interconnections; Power system transients; RLC circuits; Resonance; Robustness; Transmission lines;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.928745
  • Filename
    928745