DocumentCode
1501960
Title
Time domain modeling of lossy interconnects
Author
Svensson, Christer ; Dermer, Gregory E.
Author_Institution
Dept. of Phys. & Meas. Technol., Linkoping Univ., Sweden
Volume
24
Issue
2
fYear
2001
fDate
5/1/2001 12:00:00 AM
Firstpage
191
Lastpage
196
Abstract
A new model for dielectric loss, suitable for time domain modeling of printed circuit boards, is proposed. The model is based on a physical relaxation model. Complete time domain modeling of skin effect and dielectric losses in FR-4 boards are demonstrated and experimentally verified. Finally, the developed model is used to predict that FR-4 boards are useful for data rates up to 10 Gb/s
Keywords
circuit CAD; dielectric losses; integrated circuit interconnections; printed circuit design; skin effect; time-domain analysis; 10 Gbit/s; FR-4 boards; data rates; dielectric loss; dielectric losses; lossy interconnects; physical relaxation model; printed circuit boards; skin effect; time domain modeling; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Distributed parameter circuits; Frequency domain analysis; Integrated circuit interconnections; Printed circuits; Propagation losses; Skin effect; Time domain analysis;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.928754
Filename
928754
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