High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles

Author

Kunimune, Teppei ; Kuramoto, Masafumi ; Ogawa, Satoru ; Niwa, Miki ; Nogi, Masaya ; Suganuma, Katsuaki

Author_Institution

LED Eng. Div., Nichia Corp., Anan, Japan

Volume

2

Issue

6

fYear

2012

fDate

6/1/2012 12:00:00 AM

Firstpage

909

Lastpage

915

Abstract

A paste composed of micrometer-sized Ag particles and an organic solvent formed a soft porous bonding layer under atmospheric conditions at 200^°C and above. Using this Ag paste for die-bonding of a light-emitting diode (LED) resulted in excellent thermal resistance and reliability. Ag/Ag interactions are thought to be responsible for internal bonding, and the Ag paste does not bond strongly to other materials. To ameliorate this, polymer particles were added to the Ag paste. The flow starting temperature of the polymer did not hinder the sintering of Ag particles, and the melted polymer particles served as an adhesive. The polymer-containing Ag paste had a lower specific resistance than that of the conventional conductive adhesives, so could be treated using low-temperature processes. The presence of polymer improved the die-shearing strength during the bonding of LED die to the plastic substrate.

Keywords

adhesives; electrical conductivity; light emitting diodes; microassembling; porous materials; reliability; silver; sintering; thermal resistance; Ag; LED die; die-bonding; die-shearing strength; high-conductivity adhesive; internal bonding; light-emitting diode die-attachment; low-temperature process; low-temperature sintering; melted polymer particle; micrometer-sized particle; organic solvent; plastic substrate; reliability; sintering; soft porous bonding layer; specific resistance; temperature 200 degC; thermal resistance; Bonding; Light emitting diodes; Plastics; Polymers; Resins; Substrates; Bonding; light-emitting diodes; silver;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2012.2188292

Filename

6189395