• DocumentCode
    1502621
  • Title

    Dependence of Al-Si/Si contact resistance on substrate surface orientation

  • Author

    Onoda, Hiroshi

  • Author_Institution
    OKI Electr. Ind. Co., Inc., Tokyo, Japan
  • Volume
    9
  • Issue
    11
  • fYear
    1988
  • Firstpage
    613
  • Lastpage
    615
  • Abstract
    The dependence of Si growth on substrate orientation in the aluminium-silicon system is investigated. The Si epitaxial growth is found to show a strong dependence on the substrate surface orientation similar to the growth from Si-implanted amorphous Si. The Si growth at contact cuts changes in its quantity with substrate orientation, and Si SPE (solid-phase epitaxy) does not occur seriously on <111>-oriented substrates under the temperature in the experiment. As a result, the contact resistance of <100>-oriented samples increases rapidly with sintering time and its dispersion also increases, while those of <111>-oriented samples stay constant. The <111>-oriented surface is the most prominent for the contact-resistance stability.<>
  • Keywords
    aluminium alloys; contact resistance; elemental semiconductors; ohmic contacts; semiconductor growth; semiconductor-metal boundaries; silicon; silicon alloys; sintering; solid phase epitaxial growth; substrates; <100>-oriented samples; <111>-oriented substrates; AlSi-Si; Si growth dependence; contact resistance; epitaxial growth; ohmic contacts; semiconductors; sintering; solid-phase epitaxy; stability; substrate surface orientation; Aluminum; Amorphous materials; Contact resistance; Epitaxial growth; Heat treatment; Semiconductor films; Substrates; Surface morphology; Surface resistance; Surface treatment;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.9293
  • Filename
    9293