Low Processing Temperature of Lead-Free Solder Interconnects [Nanopackaging]

Author

Jiang, Hongjin ; Wong, C.P.

Author_Institution

Georgia Inst. of Technol., Atlanta, GA, USA

Volume

4

Issue

2

fYear

2010

fDate

6/1/2010 12:00:00 AM

Firstpage

20

Lastpage

23

Abstract

Solder paste is a homogeneous and kinetically stable mixture of solder alloy powder, flux, and vehicle, which is capable of forming metallurgical bonds at a given soldering condition. The thermal properties of tin/silver/copper (SnAgCu) alloy nanoparticles of different sizes were studied by differential scanning calorimetry (DSC). The particle size-dependent melting point and latent heat of fusion were also observed. The nanoparticle pastes completely melted and wetted on the copper surface, and tin/copper intermetallic compounds (IMCs) were formed after the reflow process. These low-melting-point SnAgCu alloy nanoparticles pastes could be used for low processing temperature of lead-free solder interconnect applications.

Keywords

copper alloys; differential scanning calorimetry; heat of fusion; materials testing; melting point; nanoparticles; silver alloys; solders; tin alloys; wetting; SnAgCu; differential scanning calorimetry; latent heat of fusion; lead-free solder interconnects; melting point; metallurgical bonds; nanoparticle pastes; solder alloy powder; solder paste; thermal properties; Copper; Environmentally friendly manufacturing techniques; Lead; Nanoparticles; Powders; Silver; Soldering; Temperature; Tin; Vehicles;

fLanguage

English

Journal_Title

Nanotechnology Magazine, IEEE

Publisher

ieee

ISSN

1932-4510

Type

jour

DOI

10.1109/MNANO.2010.936604

Filename

5472867