Title :
Scanning the issue - Interconnections - addressing the next challenge of IC technology (part II: design, characterization, and modeling)
Author :
Schutt-Aine, J.E. ; Sung-Mo Kang
Author_Institution :
University of Illinois at Urbana-Champaign
fDate :
5/1/2001 12:00:00 AM
Abstract :
Provides an overview of the technical articles and features presented in this issue.
Keywords :
Analytical models; Clocks; Crosstalk; Design automation; Design engineering; Fabrication; Integrated circuit interconnections; Integrated circuit modeling; Special issues and sections; Submillimeter wave technology;
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/JPROC.2001.929645
