DocumentCode
150339
Title
Maximum modulation index for modular multilevel converter with circulating current control
Author
Yalong Li ; Xiaojie Shi ; Bo Liu ; Wang, Fred ; Wanjun Lei
Author_Institution
Electr. Eng. & Comput. Sci. Dept., Univ. of Tennessee, Knoxville, TN, USA
fYear
2014
fDate
14-18 Sept. 2014
Firstpage
491
Lastpage
498
Abstract
In a modular multilevel converter (MMC), the circulating current control is usually adopted. It can minimize the circulating current in order to reduce the converter power loss, and also provide an active damping which is beneficial for the converter control stability. The circulating current control is normally implemented by adding a compensating component into the modulation signal. Consequently, the maximum modulation index of the fundamental frequency component will be reduced so as to allow room for circulating current control, and the utilization of dc voltage is reduced. In this paper, the impact of circulating current control on the modulation signal in MMC is investigated. The maximum obtainable modulation index of MMC is theoretically derived. It shows that the modulation index reduction is related to the converter submodule capacitance design. If the capacitance is designed for a maximum 10% voltage ripple, the circulating current control could cause as large as a 5% decrease for the maximum modulation index, or 8% for the case with 3rd harmonic component injection. Both simulation and experimental results verify the theoretical analysis.
Keywords
electric current control; modulation; power convertors; 3rd harmonic component injection; MMC; active damping; circulating current control; compensating component; converter control stability; converter power loss; converter submodule capacitance design; fundamental frequency component; maximum modulation index; modular multilevel converter; modulation signal; Capacitors; Current control; Frequency modulation; Harmonic analysis; Steady-state; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
Conference_Location
Pittsburgh, PA
Type
conf
DOI
10.1109/ECCE.2014.6953434
Filename
6953434
Link To Document