DocumentCode
150353
Title
Simulation of voltage based efficient fire sensor on FPGA using SSTL IO standards
Author
Kumar, Tanesh ; Pandey, Bishwajeet ; Das, Teerath ; Dabas, Sweety ; Kumar, Pranaw
Author_Institution
Dept. of Comput. Sci., South Asian Univ., Delhi, India
fYear
2014
fDate
22-24 April 2014
Firstpage
21
Lastpage
24
Abstract
In this paper an approach is made to design the voltage based efficient fire sensor and for that reason we have used four different kinds of Stub Series Terminated Logic (SSTL)IO standards. Airflow and heat sink are main parameters while analyzing the thermal dissipation in the circuit. In this work we have taken two values for LFM i.e. 250, 500 and three profiles for heat sink are taken, these are low profile, medium profile and high profile. When the voltage sensor is operating at 1THz and LFM is 250 with low profile heat sink, junction temperature of SSTL135_DCI is reduced up to 5.12% 6.03% and 20.77% as compared to SSTL12, SSTL12_DCI and SSTL135_R respectively. Under same operating frequency and heat sink profile with LFM as 500, we are achieving 3.69%, 5.22% and 17.99% less junction power reduction in SSTL135_DCI with respect to SSTL12, SSTL12_DCI and S S TL135_Rrespectively. This design is implemented on Kintex-7 FPGA, XC7K70T device and -3 speed grades. In this work we have used Verilog as HDL and Xilinx ISE 14.6 as simulator.
Keywords
computerised instrumentation; cooling; electric sensing devices; field programmable gate arrays; fires; hardware description languages; heat sinks; submillimetre wave detectors; terahertz wave detectors; HDL; Kintex-7 FPGA; LFM; SSTL IO standard; SSTL135_DCI; SSTL135_R; Verilog; XC7K70T device; Xilinx ISE 14.6 simulator; airflow; frequency 1 THz; heat sink; junction power reduction; junction temperature; stub series terminated logic; thermal dissipation; voltage based efficient fire sensor simulation; Field programmable gate arrays; Fires; Heat sinks; Junctions; Robot sensing systems; Standards; Temperature sensors; Airflow; FPGA; Fire Sensor; Heat Sink; SSTL;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Emerging Allied Technologies in Engineering (iCREATE), 2014 International Conference on
Conference_Location
Islamabad
Print_ISBN
978-1-4799-5131-4
Type
conf
DOI
10.1109/iCREATE.2014.6828332
Filename
6828332
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