Title :
Computer-aided thermal management of electronic networks and devices using TLM
Author :
Pulko, S.H. ; de Cogan, D.
Author_Institution :
Hull Univ., UK
fDate :
6/1/1991 12:00:00 AM
Abstract :
This article reviews the characteristics and current state of development of the transmission-line modelling (TLM) numerical technique in its application to thermal diffusion and related phenomena, within the context of the design of CAD tools for thermal management of devices and board layout
Keywords :
circuit layout CAD; cooling; electronic engineering computing; TLM; board layout; characteristics; computer aided thermal management; electronic devices; electronic networks; transmission-line modelling;
Journal_Title :
Computer-Aided Engineering Journal
