• DocumentCode
    1504023
  • Title

    Full-wave analysis of packaged microwave circuits with active and nonlinear devices: an FDTD approach

  • Author

    Kuo, Chien Nan ; Houshmand, Bijan ; Itoh, Tatsuo

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
  • Volume
    45
  • Issue
    5
  • fYear
    1997
  • fDate
    5/1/1997 12:00:00 AM
  • Firstpage
    819
  • Lastpage
    826
  • Abstract
    This paper presents a comprehensive full-wave analysis of packaged nonlinear active microwave circuits by applying the extended finite-difference time-domain (FDTD) method. Based on the approach of using equivalent sources, the device-wave interaction is characterized and incorporated into the FDTD time-marching scheme. As a consequence, analysis of linear and nonlinear properties, including harmonic generation and intermodulation, can be accomplished by employing a large-signal device circuit model. The implementation is first validated by comparing results of FDTD and HP MDS simulation of the circuit without the packaging structure. The analysis then goes beyond the capability of the circuit simulator to include the packaging effect. This analysis is useful in circuit design involving electromagnetic compatibility/electromagnetic interference (EMC/EMI) problems
  • Keywords
    MMIC; electromagnetic compatibility; electromagnetic interference; finite difference time-domain analysis; integrated circuit design; integrated circuit modelling; integrated circuit packaging; intermodulation; FDTD approach; circuit design; device-wave interaction; electromagnetic compatibility/electromagnetic interference; equivalent sources; extended finite-difference time-domain method; full-wave analysis; harmonic generation; intermodulation; large-signal device circuit model; nonlinear active microwave circuits; packaged microwave circuits; packaging effect; time-marching scheme; Circuit simulation; Electromagnetic compatibility; Finite difference methods; Frequency conversion; Harmonic analysis; Microwave circuits; Microwave devices; Microwave theory and techniques; Packaging; Time domain analysis;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.575606
  • Filename
    575606