Title :
QC-Fill: Quick-and-Cool X-Filling for Multicasting-Based Scan Test
Author :
Tzeng, Chao-Wen ; Huang, Shi-Yu
Author_Institution :
Dept. of Electr. Eng., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
Abstract :
This paper presents an X-fill scheme that properly utilizes the don´t-care bits in test patterns to simultaneously reduce the test time as well as the test power (including both capture power and shifting power). This scheme, called Quick-and-Cool X-fill (QC-Fill), built upon the multicasting-based scan architecture, further leverages on the merits of previous low-capture-power X-fill methods through techniques like multicasting-driven X-fill and clique stripping. QC-Fill is independent of the automatic test pattern generation patterns and does not require any extra area overhead. Experimental results demonstrate that this scheme strikes a good balance between the seemingly conflicting criteria of low power and test compression.
Keywords :
integrated circuit testing; low-power electronics; clique stripping; low-power-driven clique partitioning; multicasting; quick-and-cool X-filling; scan test; test compression; Automatic test pattern generation; Automatic testing; Chaos; Circuit testing; Continuous wavelet transforms; Costs; Design for testability; Helium; Logic; Test pattern generators; Low-capture-power X-fill (LCP-Fill); low-power scan; multicasting; scan test; test compression;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TCAD.2009.2030353