Test structures for MCM-D technology characterization

Author

Lozano, Manuel ; Santander, Joaqu ; Cabruja, Enric ; Perello, Carles ; Ullan, Miguel ; Lora-Tamayo, Emilio ; Doyle, Rory ; McCarthy, Ger ; Barton, John

Author_Institution

CNM-IMB, Univ. Autonoma de Barcelona, Spain

Volume

12

Issue

2

fYear

1999

fDate

5/1/1999 12:00:00 AM

Firstpage

184

Lastpage

192

Abstract

In this paper we present a set of classic and novel test structures addressed to fully characterize multichip module (MCM) technologies. The structures have been implemented and fabricated in our D-type, flip-chip, ball grid array, silicon substrate technology. In this technology, a silicon chip is used as a substrate on which other commercial chips are flipped and soldered by a screen-printing method. These complex technologies have specific test problems that are solved with this approach. We have specially focused on the measurement of the effects of wafer rerouting on CMOS parameters, the chip-to-chip ball contact resistance, thermal behavior, yield, and reliability of the technology. Experimental results are shown, proving that this methodology is suitable for our technology and can also be applied to other different MCM technologies

Keywords

ball grid arrays; flip-chip devices; integrated circuit testing; multichip modules; CMOS IC; D-type flip-chip ball grid array; MCM-D technology; Si; contact resistance; multichip module; reliability; screen printing; silicon substrate; soldering; test structure; thermal properties; wafer rerouting; yield; CMOS technology; Capacitors; Circuit testing; Fabrication; Integrated circuit interconnections; Multichip modules; Resistors; Semiconductor device testing; Silicon; Substrates;

fLanguage

English

Journal_Title

Semiconductor Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

0894-6507

Type

jour

DOI

10.1109/66.762876

Filename

762876