DocumentCode :
1505010
Title :
SOI MOSFET structure with a junction-type body contact for suppression of pass gate leakage
Author :
Chung, In-Young ; Park, Young June ; Min, Hong Shick
Author_Institution :
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Volume :
48
Issue :
7
fYear :
2001
fDate :
7/1/2001 12:00:00 AM
Firstpage :
1360
Lastpage :
1365
Abstract :
A SOI MOSFET structure with a junction-type body contact [body-junctioned-to-gate (BJG)] is proposed to effectively suppress the parasitic bipolar effect in all kinds of MOSFETs including the pass transistor, which can be realized with compact design and simple processes. It utilizes the buried contact process to minimize the area consumption. Various on-chip test circuits have been fabricated to verify the BJG characteristics and it is shown that the proposed structure provides nearly perfect immunity against the circuit failure caused by the parasitic bipolar effect and an excellent speed performance, so that it can be a promising candidate for the SOI circuits
Keywords :
MOSFET; leakage currents; low-power electronics; semiconductor device measurement; silicon-on-insulator; BJG characteristics; MOSFETs; SOI MOSFET structure; Si; area consumption; buried contact process; circuit failure; junction-type body contact; on-chip test circuits; parasitic bipolar effect; pass gate leakage; pass transistor; speed performance; Circuit testing; Contacts; Gate leakage; Helium; Immune system; MOSFET circuits; Power MOSFET; Process design; Schottky diodes; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.930652
Filename :
930652
Link To Document :
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