• DocumentCode
    1505059
  • Title

    New Leakage Mechanism and Dielectric Breakdown Layer Detection in Metal-Nanocrystal-Embedded Dual-Layer Memory Gate Stack

  • Author

    Lwin, Zin Zar ; Pey, Kin Leong ; Raghavan, Nagarajan ; Chen, Yining ; Mahapatra, Souvik

  • Author_Institution
    Div. of Microelectron., Nanyang Technol. Univ., Singapore, Singapore
  • Volume
    32
  • Issue
    6
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    800
  • Lastpage
    802
  • Abstract
    We study the dielectric breakdown (BD) behaviors in MOS capacitor structures with metal-nanocrystal (NC)-embedded dual-layer (SiO2/Al2O3) gate stack. Using a unique stressing methodology of inducing a BD path in one of the two dielectric layers, the effect of BD in the blocking or tunnel oxide is assessed. The first layer to BD is determined based on the physics underlying the Coulomb charging energy in relation to thermal energy gained by electrons at low voltage and in the very low temperature regime ranging from 11 K to 300 K. The established methodology to detect the BD layer in an NC-embedded dual-layer dielectric can be applied for any bilayered NC system, regardless of the thickness of the tunnel and blocking oxide layer. It is noted that BD in SiO2 leads to lateral charging/discharging among NCs, while, in Al2O3, it leads to spontaneous BD of bilayer gate stacks owing to high localized trap generation rate around the high-κ dielectric grain boundary and local electric field enhancement in the vicinity of metal NCs.
  • Keywords
    MOS capacitors; aluminium compounds; boundary layers; electric breakdown; high-k dielectric thin films; nanostructured materials; semiconductor storage; silicon compounds; tunnelling; BD path; Coulomb charging energy; MOS capacitor structure; NC-embedded dual-layer dielectric; SiO2-Al2O3; bilayer gate stack; bilayered NC system; blocking oxide layer; dielectric breakdown layer detection; high-κ dielectric grain boundary; leakage mechanism; local electric field enhancement; metal-nanocrystal-embedded dual-layer memory gate stack; nanocrystal memory; nonvolatile memory; stressing methodology; temperature 11 K to 300 K; thermal energy; trap generation rate; tunnel thickness; Aluminum oxide; Dielectrics; Logic gates; Nanocrystals; Stress; Tunneling; Dielectric breakdown; high-$kappa$ ; metal nanocrystal (NC); nonvolatile memory;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2131114
  • Filename
    5756450