DocumentCode
1505059
Title
New Leakage Mechanism and Dielectric Breakdown Layer Detection in Metal-Nanocrystal-Embedded Dual-Layer Memory Gate Stack
Author
Lwin, Zin Zar ; Pey, Kin Leong ; Raghavan, Nagarajan ; Chen, Yining ; Mahapatra, Souvik
Author_Institution
Div. of Microelectron., Nanyang Technol. Univ., Singapore, Singapore
Volume
32
Issue
6
fYear
2011
fDate
6/1/2011 12:00:00 AM
Firstpage
800
Lastpage
802
Abstract
We study the dielectric breakdown (BD) behaviors in MOS capacitor structures with metal-nanocrystal (NC)-embedded dual-layer (SiO2/Al2O3) gate stack. Using a unique stressing methodology of inducing a BD path in one of the two dielectric layers, the effect of BD in the blocking or tunnel oxide is assessed. The first layer to BD is determined based on the physics underlying the Coulomb charging energy in relation to thermal energy gained by electrons at low voltage and in the very low temperature regime ranging from 11 K to 300 K. The established methodology to detect the BD layer in an NC-embedded dual-layer dielectric can be applied for any bilayered NC system, regardless of the thickness of the tunnel and blocking oxide layer. It is noted that BD in SiO2 leads to lateral charging/discharging among NCs, while, in Al2O3, it leads to spontaneous BD of bilayer gate stacks owing to high localized trap generation rate around the high-κ dielectric grain boundary and local electric field enhancement in the vicinity of metal NCs.
Keywords
MOS capacitors; aluminium compounds; boundary layers; electric breakdown; high-k dielectric thin films; nanostructured materials; semiconductor storage; silicon compounds; tunnelling; BD path; Coulomb charging energy; MOS capacitor structure; NC-embedded dual-layer dielectric; SiO2-Al2O3; bilayer gate stack; bilayered NC system; blocking oxide layer; dielectric breakdown layer detection; high-κ dielectric grain boundary; leakage mechanism; local electric field enhancement; metal-nanocrystal-embedded dual-layer memory gate stack; nanocrystal memory; nonvolatile memory; stressing methodology; temperature 11 K to 300 K; thermal energy; trap generation rate; tunnel thickness; Aluminum oxide; Dielectrics; Logic gates; Nanocrystals; Stress; Tunneling; Dielectric breakdown; high-$kappa$ ; metal nanocrystal (NC); nonvolatile memory;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2011.2131114
Filename
5756450
Link To Document