DocumentCode
1505070
Title
Fully coupled electrothermal mixed-mode device simulation of SiGe HBT circuits
Author
Grasser, Tibor ; Selberherr, Siegfried
Author_Institution
Inst. for Microelectron., Tech. Univ. of Vienna, Austria
Volume
48
Issue
7
fYear
2001
fDate
7/1/2001 12:00:00 AM
Firstpage
1421
Lastpage
1427
Abstract
It is well known that for the design and simulation of state-of-the-art circuits thermal effects like self-heating and coupling between individual devices must be taken into account. As compact models for modern or experimental devices are not readily available, a mixed-mode device simulator capable of thermal simulation is a valuable source of information, Considering self-heating and coupling effects results in a very complex equation system which can only be solved using sophisticated techniques. We present a fully coupled electrothermal mixed-mode simulation of an SiGe HBT circuit using the design of the μA709 operational amplifier. By investigating the influence of self-heating effects on the device behavior we demonstrate that the consideration of a simple power dissipation model instead of the lattice heat flow equation is a very good approximation of the more computation time consuming solution of the lattice heat flow equation
Keywords
Ge-Si alloys; heterojunction bipolar transistors; mixed analogue-digital integrated circuits; semiconductor device models; semiconductor materials; μA709 operational amplifier; HBT circuits; SiGe; coupled electrothermal mixed-mode device simulation; electrothermal mixed-mode simulation; mixed-mode device simulator; power dissipation model; self-heating; thermal simulation; Circuit simulation; Coupling circuits; Electrothermal effects; Equations; Germanium silicon alloys; Heterojunction bipolar transistors; Information resources; Lattices; Operational amplifiers; Silicon germanium;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.930661
Filename
930661
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