DocumentCode :
1506115
Title :
A High-Power Temperature-Stable Electrostatic RF MEMS Capacitive Switch Based on a Thermal Buckle-Beam Design
Author :
Mahameed, Rashed ; Rebeiz, Gabriel M.
Author_Institution :
Electr. & Comput. Eng. Dept., Univ. of California at San Diego, La Jolla, CA, USA
Volume :
19
Issue :
4
fYear :
2010
Firstpage :
816
Lastpage :
826
Abstract :
This paper presents the design, fabrication and measurements of a novel vertical electrostatic RF MEMS switch which utilizes the lateral thermal buckle-beam actuator design in order to reduce the switch sensitivity to thermal stresses. The effect of biaxial and stress gradients are taken into consideration, and the buckle-beam designs show minimal sensitivity to these stresses. Several switches with 4,8, and 12 suspension beams are presented. All the switches demonstrate a low sensitivity to temperature, and the variation in the pull-in voltage is ~ -50 mV/°C from 25-125°C. The change in the up-state capacitance for the same temperature range is <; ± 3%. The switches also exhibit excellent RF and mechanical performances, and a capacitance ratio of ~ 20-23 (Cυ. = 85-115 fF, Cd = 1.7-2.6 pF) with Q > 150 at 10 GHz in the up-state position is reported. The mechanical resonant frequencies and quality factors are fο = 60-160 kHz and Qm = 2.3-4.5, respectively. The measured switching and release times are ~ 2-5 μs and ~ 5-6.5 μs, respectively. Power handling measurements show good stability with ~ 4 W of incident power at 10 GHz.
Keywords :
capacitance measurement; electrostatic actuators; microswitches; thermal stresses; biaxial gradients; capacitance ratio; frequency 10 GHz; frequency 60 kHz to 160 kHz; lateral thermal buckle-beam actuator design; mechanical resonant frequencies; power handling measurements; pull-in voltage; quality factors; stress gradients; temperature 25 degC to 125 degC; temperature-stable vertical electrostatic RF MEMS capacitive switch; thermal stresses; up-state capacitance; Microactuators; RF MEMS; switches; temperature sensitivity;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2010.2049475
Filename :
5475198
Link To Document :
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