• DocumentCode
    1506148
  • Title

    Thermal impedance of cooling fins

  • Author

    Diebold, E. J. ; Luft, Werner

  • Author_Institution
    International Rectifier Corporation, El Segundo, Calif.
  • Volume
    78
  • Issue
    2
  • fYear
    1959
  • Firstpage
    141
  • Lastpage
    141
  • Abstract
    SEMICONDUCTOR DEVICES are often bolted to a metal plate which acts as a cooling fin. This paper shows a determination of optimum design proportions.
  • Keywords
    Cooling; Heat transfer; Heating; Impedance; Materials; Metals; Rectifiers;
  • fLanguage
    English
  • Journal_Title
    Electrical Engineering
  • Publisher
    ieee
  • ISSN
    0095-9197
  • Type

    jour

  • DOI
    10.1109/EE.1959.6446204
  • Filename
    6446204
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1506148