DocumentCode :
1507336
Title :
Liquid Metal-Filled Micro Heat Pipes for Thermal Management of Solid-State Devices
Author :
Dean, Robert Neal ; Harris, Daniel Kevin ; Palkar, Ashish Yudhishthir ; Wonacott, Gary Dean
Author_Institution :
Dept. of Electr. & Comput. Eng., Auburn Univ., Auburn, AL, USA
Volume :
59
Issue :
12
fYear :
2012
Firstpage :
4888
Lastpage :
4894
Abstract :
Microelectromechanical systems technology can be used to realize micro heat pipes (MHPs) for thermal management of solid-state devices in industrial applications. Similar to the uses of traditional heat pipes in the macroworld, MHPs provide a passive and efficient way of spreading heat away from a heat source. MHPs have recently been demonstrated using alcohol or water as the working fluid. Liquid metals have superior thermal properties compared to water or alcohol and have been used in macroscale heat pipes for many years. However, liquid metal working fluids have not previously been demonstrated in MHPs. By utilizing indium cold welding of micromachined silicon structures, liquid metal-filled MHPs were successfully fabricated and then evaluated. Their performance was proven to be superior to the performance of equivalent water-filled MHPs.
Keywords :
heat pipes; indium; liquid metals; micromechanical devices; silicon; thermal management (packaging); heat source; heat spreading; indium cold welding; liquid metal filled micro heat pipes; liquid metals; microelectromechanical systems technology; micromachined silicon structures; solid-state devices; thermal management; water-filled MHP; working fluid; Fluids; Heating; Mercury (metals); Microelectromechanical systems; Micromechanical devices; Temperature measurement; Thermal analysis; Micro heat pipe (MHP); microelectromechanical systems (MEMS); thermal management;
fLanguage :
English
Journal_Title :
Industrial Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0046
Type :
jour
DOI :
10.1109/TIE.2012.2196893
Filename :
6193589
Link To Document :
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