DocumentCode
1507336
Title
Liquid Metal-Filled Micro Heat Pipes for Thermal Management of Solid-State Devices
Author
Dean, Robert Neal ; Harris, Daniel Kevin ; Palkar, Ashish Yudhishthir ; Wonacott, Gary Dean
Author_Institution
Dept. of Electr. & Comput. Eng., Auburn Univ., Auburn, AL, USA
Volume
59
Issue
12
fYear
2012
Firstpage
4888
Lastpage
4894
Abstract
Microelectromechanical systems technology can be used to realize micro heat pipes (MHPs) for thermal management of solid-state devices in industrial applications. Similar to the uses of traditional heat pipes in the macroworld, MHPs provide a passive and efficient way of spreading heat away from a heat source. MHPs have recently been demonstrated using alcohol or water as the working fluid. Liquid metals have superior thermal properties compared to water or alcohol and have been used in macroscale heat pipes for many years. However, liquid metal working fluids have not previously been demonstrated in MHPs. By utilizing indium cold welding of micromachined silicon structures, liquid metal-filled MHPs were successfully fabricated and then evaluated. Their performance was proven to be superior to the performance of equivalent water-filled MHPs.
Keywords
heat pipes; indium; liquid metals; micromechanical devices; silicon; thermal management (packaging); heat source; heat spreading; indium cold welding; liquid metal filled micro heat pipes; liquid metals; microelectromechanical systems technology; micromachined silicon structures; solid-state devices; thermal management; water-filled MHP; working fluid; Fluids; Heating; Mercury (metals); Microelectromechanical systems; Micromechanical devices; Temperature measurement; Thermal analysis; Micro heat pipe (MHP); microelectromechanical systems (MEMS); thermal management;
fLanguage
English
Journal_Title
Industrial Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0278-0046
Type
jour
DOI
10.1109/TIE.2012.2196893
Filename
6193589
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