DocumentCode :
1507843
Title :
Identification of stress-induced leakage current components and the corresponding trap models in SiO2 films [MOS transistors]
Author :
Sakakibara, Kiyohiko ; Ajika, Natsuo ; Hatanaka, Masahiro ; Miyoshi, Hirokazu ; Yasuoka, Akihiko
Author_Institution :
ULSI Lab., Mitsubishi Electr. Corp., Hyogo, Japan
Volume :
44
Issue :
12
fYear :
1997
fDate :
12/1/1997 12:00:00 AM
Firstpage :
2267
Lastpage :
2273
Abstract :
Time-decay stress-induced leakage current (SILC) has been systematically investigated for the cases of both Fowler-Nordheim (FN) stress and substrate hot-hole stress. From the three viewpoints of the reproducibility of the current component for the gate voltage scan, the change of oxide charge during the gate voltage scan, and the resistance of the current component to thermal annealing, it has been found that time-decay stress-induced leakage current is composed of five current components, regardless of stress type. Trap models corresponding to each current component have been proposed. In addition, it has also been proven that holes generate the electron traps related to one of those current components
Keywords :
MOSFET; electron traps; hot carriers; insulating thin films; internal stresses; leakage currents; semiconductor device models; silicon compounds; Fowler-Nordheim stress; SiO2; current component; electron traps; gate voltage scan; oxide charge; reproducibility; stress-induced leakage current components; substrate hot-hole stress; thermal annealing; trap models; Annealing; Current measurement; Electric breakdown; Electron traps; Hot carriers; Leakage current; Substrates; Thermal resistance; Thermal stresses; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.644649
Filename :
644649
Link To Document :
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