• DocumentCode
    1508134
  • Title

    Quantitative Edge Cross-Section Angle Impact on Conductor Loss

  • Author

    Vincent, Tracey S. ; Itovich, Yan ; Bar-On, Isa

  • Author_Institution
    Dept. of Mater. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
  • Volume
    33
  • Issue
    2
  • fYear
    2010
  • fDate
    6/1/2010 12:00:00 AM
  • Firstpage
    386
  • Lastpage
    390
  • Abstract
    This paper describes a method of forming different conductor edge cross-section angles by using thick-film screen printing on substrates of different surface roughness. The edge angle for each surface type is compared visually and measured using an interferometer microscope. The conductor edge angle is correlated to the respective transmission loss sample. The impact of different edge angles on conductor loss is observed.
  • Keywords
    conductors (electric); dielectric losses; electronics packaging; interferometry; printed circuits; printing; surface roughness; conductor edge cross-section angles; conductor loss edge angle; interferometer microscope; surface roughness; thick-film PCB; thick-film screen printing; Conductor loss; edge angle; surface roughness; surface topography; thick film;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2010.2050380
  • Filename
    5477219
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1508134