• DocumentCode
    150829
  • Title

    Condition monitoring of submodule capacitors in modular multilevel converters

  • Author

    Yun-Jae Jo ; Thanh Hai Nguyen ; Dong-Choon Lee

  • Author_Institution
    Dept. of Electr. Eng., Yeungnam Univ., Gyeongsan, South Korea
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    2121
  • Lastpage
    2126
  • Abstract
    This paper proposes a condition monitoring scheme of submodule (SM) capacitors in the modular multilevel converters (MMC), which is based on the capacitance estimation using the information of the current and voltage ripples of the capacitors. In order to induce the voltage ripple in the capacitor, a controlled AC current is injected into the circulating current loop through the action of the average voltage control of each SM in the converter leg. The capacitor current is calculated from the arm current and its switching state. By processing these AC voltage and current with digital filters, the capacitance is estimated by a recursive least square (RLS) algorithm. The validity of the proposed scheme has been verified by simulation results for the 1-MW 7-level modular multilevel converter. Also, its feasibility has been proved by experimental results for a reduced-scale prototype.
  • Keywords
    condition monitoring; digital filters; least squares approximations; power capacitors; power convertors; recursive estimation; MMC; RLS algorithm; SM capacitor; capacitance estimation; circulating current loop; condition monitoring scheme; controlled AC current injection; current ripple information; digital filter; modular multilevel converter; power 1 MW; recursive estimation; recursive least square algorithm; submodule capacitor; voltage control; voltage ripple information; Band-pass filters; Capacitance; Capacitors; Converters; Estimation; Switches; Voltage control; Capacitance estimation; condition monitoring; modular multilevel converter; submodule capacitor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
  • Conference_Location
    Pittsburgh, PA
  • Type

    conf

  • DOI
    10.1109/ECCE.2014.6953683
  • Filename
    6953683