Abstract :
A new technique for producing “cracker-crumb”-sized microelectronic circuits reduces the circuit production time-cycle from 10 weeks to 2 weeks and allows an endless variety of circuits to be produced. The new technique allows the formation of many different circuits simultaneously on the same wafer. General Electric Co., who announce the system, believe that this is the first microelectronic production process which allows more than one circuit configuration to be formed on a wafer at the same time and which eliminates the need for “flying” interconnecting leads. Lower production costs are expected to result from this.
