Cationic polymerization ultraviolet curing method for preparing epoxy resin encapsulation of solar cell: Used for portable photovoltaic devices

The optical surface of solar cell module with microstructure needs to be permanently protected by encapsulation. Currently, glue dripping procedure is the most popular process for the epoxy resin encapsulation of solar cells, while this process cause several obvious defects. In the present paper, a cationic polymerization Ultraviolet (UV) curing epoxy resin coating was formed and cured afterwards under the high pressure mercury lamp for encapsulating the solar cell, which was used mainly on portable PV devices. It turns out that this new method has several advantages over the glue dripping procedure currently used, with higher photoelectric conversion efficiency and better performance in impact resistance and flexibility.